Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics Book 30)

Full Title: Advanced Materials for Thermal Management of Electronic Packaging (Springer Series in Advanced Microelectronics Book 30)
ISBN: 1441977597
ISBN13: 9781441977595
List Price: USD $80.99
Authors: Tong, Xingcun Colin

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This is an excerpt from the ISBNdb database. Need more data? Get a FREE 7 day trial and get access to the full database of over 35 million books and all API data points including title, author, publisher, publish date, binding, pages, list price, and more.

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