Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Full Title: Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability
ISBN: 0471594466
ISBN13: 9780471594468
List Price: USD $190.00
Authors: Pecht, Michael

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This is an excerpt from the ISBNdb database. Need more data? Get a FREE 7 day trial and get access to the full database of over 35 million books and all API data points including title, author, publisher, publish date, binding, pages, list price, and more.