Microelectronics Packaging Handbook: Subsystem Packaging Part III
Full Title: | Microelectronics Packaging Handbook: Subsystem Packaging Part III |
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ISBN: | 0412084511 |
ISBN13: | 9780412084515 |
List Price: | USD $249.99 |
Authors: |
Tummala, R.R. Rymaszewski, Eugene J. Klopfenstein, Alan G. |