Microelectronics Packaging Handbook: Subsystem Packaging Part III

Full Title: Microelectronics Packaging Handbook: Subsystem Packaging Part III
ISBN: 0412084511
ISBN13: 9780412084515
List Price: USD $249.99
Authors: Tummala, R.R.
Rymaszewski, Eugene J.
Klopfenstein, Alan G.

This is an excerpt from the ISBNdb database. Need more data? Get a FREE 7 day trial and get access to the full database of over 35 million books and all API data points including title, author, publisher, publish date, binding, pages, list price, and more.

This is an excerpt from the ISBNdb database. Need more data? Get a FREE 7 day trial and get access to the full database of over 35 million books and all API data points including title, author, publisher, publish date, binding, pages, list price, and more.